Molecular Dynamics Simulations of Gold and Copper Alloy

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gold and copper alloy is a mixture of gold and copper that can be found in jewelry, electronics, and many other applications. These alloys are typically characterized by a higher hardness and greater ductility for casting than pure gold. These alloys are also very resistant to corrosion, making them ideal for certain applications.

Depending on the application, the use of various metal additives can be used to enhance the properties of the base metal. These additives include copper, zinc, and silver.

The addition of these elements can improve the tensile strength of the alloy, while the low melting point of the zinc allows for better casting properties. Zinc can also reduce the porosity of the alloy, which can lead to a more desirable surface appearance.

This can be particularly helpful for white and yellow gold karats where the color of the gold is crucial to its aesthetic appeal. However, the use of these additives should be carefully weighed against their corrosive potential when compared to pure copper.

Molecular Dynamics Simulations of Au-Cu Nanoalloys: Size and Shape Effects

For several polyhedral morphologies, a regular solution is observed at the bulk scale (Figure 3). The solution degenerates into an ideal one at small sizes (4 nm) for both octahedral and decahedral morphologies, which indicates that the alloy is enriched in copper when the size decreases.

The shape-dependent size effect on the alloy is attributed to the difference in the surface energy of gold and copper at all size ranges studied. This is most apparent in the dodecahedron, truncated octahedron and icosahedron with a Cu-rich core/Au-rich surface.