Tin powder and auxiliary composition
SMT manufacturing relies on quality solder paste printing. Many factors affect the quality of solder paste’s printing. It is important to know the properties of solder dust, composition of solder and ratio of solder to flux. These parameters will determine melting points, printability, weldability, quality of solder joints, and printing abilities. The eutectic temperature of tin powder-alloy components should be as close as possible to the eutectic. It is calculated as the proportion of tin dust to flux expressed in terms of its weight. The viscosity, printing and print properties of solder paste are directly affected by the content of tin. In general, the content of tin powder is 7590%. Tin powder is 7590% in general. It is used for template printing and no-cleaning solder paste. The content of the tin used in drip coating is 7585 p>
The size, shape, and distribution of the tin powder particles
It is important to consider the size, shape, and uniformity of the tin powder particles in order to influence the properties. It is best to use smaller particles for solder paste printing, particularly when using high density products that have a narrow spacing. About 1/5th of the opening size for a template is used to measure the particle diameter. While the pattern of solder paste printed with small particles alloy powder is very detailed, edge collapse can easily be caused by it. The potential for oxidation is greater due to small particles’ large surfaces. If the assembly density of the powder is low, it’s possible to choose a coarser alloy powder without having an impact on the printing ability. This can improve both the weldability as well as reduce the price for solder paste. Also, the form of the alloy powder can impact the paste’s printingability and desorption as well as weldability. Spherical-particle alloy paste has good printing properties, low viscosity and easy to collapse after printing. This makes it ideal for printing metal templates and narrow spacing screens. Spherical particles are small in size, have low oxygen levels, and have bright welding spots, all of which can be beneficial for improving welding quality. At present, however, they are mostly used.
Solder paste, a fluid that is highly thixotropic can be made to flow by external forces. It is important to consider the impact of viscosity on solder paste. Too high viscosity can cause solder paste not to flow through the template hole.
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