Silicon Nitride Material Properties

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silicon nitride material properties include high strength and fracture toughness at room temperature, as well as good thermal shock resistance and oxidation resistance. These characteristics make it a useful material for applications that need to perform under harsh conditions and require a lightweight, yet robust, material.

In the aerospace industry, silicon nitride is used to replace legacy materials in ball bearings, radomes, and RF windows. Its light weight and exceptional mechanical robustness make it an ideal replacement for these critical parts, reducing both weight and maintenance requirements for aircraft.

As an insulator and masking material, silicon nitride is formed by chemical vapor deposition or plasma-enhanced chemical vapor deposition (PECVD). This process has the advantage of being able to deposit a pure film with excellent coverage.

This material is often incorporated into hard masks for circuits that are sensitive to oxidation and thermal damage. It is also used to create dielectric layers for electronics or micro-mechanical applications.

It has a better diffusion barrier than silicon dioxide, which is commonly used for passivation in integrated circuits. It also has better resistivity to water molecules and sodium ions, which are two major sources of corrosion and instability in microelectronics.

It can also be used to create radio frequency (RF) antennas, which is advantageous for applications that need to transmit and receive signals over long distances at high speeds. It has a moderate dielectric constant and is not affected by high-velocity airborne RF emissions, making it an excellent choice for these applications.